Introduction
Next Generation Medium Speed Chip Mounter
As a chip mounter which was developed focusing on visible improvements, one of the three major indexes, this chip mounter provides the optimum productivity necessary for batch production.
• Improves actual productivity
• Improves placement quality
• Reduces loss rate
Highest Performance among Chip Mounters of the Same Class
Highest Applicability of Medium Speed Chip Mounters to PCBs
• 510 x 510mm (standard) / 1500 x 460mm (option)
– Possible to produce PCBs up to 1,500mm(L) x 460mm(W) in size
Expands the Component Recognition Range with a High Pixel Camera
• The fly camera can recognize all chips of 03015 ~ 16mm
Improves Simultaneous Pickup Rate
• Arranges pocket positions automatically through communication between the machine and feeder
Improves the Placement Speed of an Odd-Shape Component
• Increases speed by approximately 25% by optimizing the fix camera recognized motion sequence
Places Microchips Stably
Recognizes the Nozzle Center
• Improves the microchip loss rate and placement quality by preventing the occurrence of air leaks
Run Time Calibration
• Maintains placement accuracy by performing automatic calibration during production
Auto Maintenance Prevents Pickup Error and Maintains Placement Quality*
• Measures pneumatic pressure and flow rate of the nozzle and shaft
• Removes foreign materials on the nozzle and shaft by high pressure
air blast
Increased Convenience of Operation
Reduces the Teaching Time of a Large Odd-shape Component
• Expanded FOV of Fiducial Camera: 7.5mm → 12mm
– Reduces the time to teach the component pickup/placement point and improves the convenience of teaching
Maintains the Pickup Coordinate of the Common Feeder
• When changing a model, reduces the model changing time by succeeding the pickup information of a similar model
Unifies the Chip Component Lighting Level
• By setting the same lighting value collectively, minimizes the lighting changing time, removes the productivity deviation by machine and improves the convenience of part DB management
Support of Multi-vendor Component *
• It’s possible to manage the same components supplied by two suppliers in one part name, so it’s Possible to perform production continuously without changing the PCB program for the components supplied by different vendors
Teaches Large-sized Components Easily (Panoramic View)
• Performs split-recognition of a large-sized component that is out of
the camera recognition range (FOV) and merges split component images into a single image before displaying.
– Easily teaches the pickup/placement position of a large-sized component
| Model | DECAN S1 | |
| Alignment | Fly Camera + Fix Camera | |
| The number of spindles | 10 spindles x 1 Gantry | |
| Placement Speed | 47,000 CPH (Optimum) | |
| Placement Accuracy | ±28μm @ Cpk≥ 1.0 | |
| Component Range | Fly Camera | 03015 ~ □16mm Fix Camera |
| 42mm ~ □55mm (MFOV) L55mm ~ L75mm Connector (MFOV) | ||
| Max. Height | 10mm (Fly), 15mm (Fix) | |
| PCB Size (mm) | Min. | 50(L) x 40(W) |
| Max. | 510(L) x 510(W) Option~ Max. 1,500(L) x 460(W) | |
| PCB Thickness (mm) | 0.38 ~ 4.2 | |
| Feeder Capacity (8mm standard) | 60ea / 56ea (Fixed feederbase / Docking Cart) 120ea / 112ea (Fixed feederbase / Docking Cart)- Option | |
| Utility | Power | 3Phase AC200 / 208 / 220 / 240 / 380 / 415V Max. 3.5kVA |
| Air Consumption | 5.0~7.0kgf/cm2 50Nℓ/min (Vacuum Pump) | |
| Weight (kg) | Approx. 1,600 | |
| External Dimension (mm) | 1,430(L) x 1,740(D) x 1,485(H) | |
Achieve precision and speed in electronics assembly with our high-performance solution. Benefit from versatile component compatibility, advanced vision inspection, and user-friendly operation. Elevate your production process and stay competitive in the electronics industry with Samsung's SMT technology.
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FAQ:
1. What is a chip mounter?
A chip mounter, also known as a pick-and-place machine, is an automated device used in electronics manufacturing. It precisely picks up electronic components, such as surface mount devices (SMDs), and places them onto printed circuit boards (PCBs) during the surface mount technology (SMT) assembly process.
2. What is a surface mount chip?
A surface mount chip, often referred to as a surface mount device (SMD) or chip component, is a miniature electronic component designed for surface mounting directly onto a PCB. These components are typically smaller and lighter than their through-hole counterparts and are soldered onto the PCB's surface.
3. What is surface mount in electrical?
Surface mount in electrical engineering refers to the method of mounting electronic components directly onto the surface of a printed circuit board (PCB). This approach eliminates the need for holes (through-holes) in the PCB, and components are soldered directly to the PCB's surface, resulting in a more compact and efficient assembly process. Surface mount technology (SMT) has become a standard in modern electronics manufacturing.
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