Advanced Chip shooter
The Decan Line maximizes productivity in connection with the T-solution, an optimized software for integrated management, and introduces stable quality.
DECAN S2 increases the speed/accuracy for the placement of microchips (03015)
Advance chip mounter
Fast & flexible pick and place machine
Multi-functional SMT placement
Fast flexible pick & place machine
Model | DECAN S2 | DECAN F2 | DECAN L2 |
Of Spindles | 2 Gantryx10 Spidles/ Head | 2 Gantryx10 Spidles/ Head | 2 Gantryx6 Spidles/ Head |
Placement Speed | 92,000 CPH (Optimum) | 80,000 CPH (Optimum) | 56,000 CPH (Flying Vision,Optimum) |
Vison | Flying Vision | Flying Vision Stage Vision (Optimun) | |
Placement Accuracy | ±28μm Cpk≥1.0 | ±40μm Cpk≥1.0 | |
Component Range | 03015 ~ 12mm(H10mm) | 0402(01005) ~ 16mm(H10mm) | 0402(01005) ~ 21mm(H12mm) |
PCB Size | 50x40~510x460mm (standard) ~610x460mm(Option), ~740x460(Option) ~810x460mm(Option), ~1200x460(Option) | ||
Conveyor Configurations | Standard : 1-2- 1 Option : 1-2-2/2-2-2/2-2-1/1-1-1 Factory Option : Single Conveyor (Jedec Tray 2ea) | ||
Feeder Capacity | 120ea (8mm) | ||
Power | Voltage : 3 phase AC200/208/220/240/380/415V ±10% Frequency : 50/60Hz Power Consumption : Max. 5.0kVA | ||
Air Consumption | 50Nl/min | ||
Weight | About 1,800kg | ||
External Dimensions (mm) | 1,430(L) x 1,740(D) x 1,485(H) |
* Under optimum condition of specified by HANWHA TECHWIN.
FAQ:
1. What is the pick and place process in SMT?
The pick and place process in Surface Mount Technology (SMT) involves the automated placement of surface mount components (SMDs) onto printed circuit boards (PCBs). Pick and place machines precisely pick up components and position them on the PCB before soldering.
2. What are the stages of SMT reflow?
SMT reflow soldering typically involves several stages: preheating to remove moisture, a gradual temperature ramp-up, a peak temperature phase where solder melts, and finally, cooling to solidify the solder joints.
3. What is the temperature of SMT reflow?
The temperature of SMT reflow soldering varies depending on the solder paste used and the components on the PCB. Generally, peak temperatures range from 215°C to 260°C (419°F to 500°F).
4. How can I improve my SMT process?
To enhance your SMT process, consider optimizing solder paste application, ensuring accurate component placement, monitoring temperature profiles, conducting regular equipment maintenance, and implementing quality control measures like automated inspections.
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