Introduction:
PCB Size: 150*150mm-400*400mm
Passing height: Up/Down 30mm
I.C.T LV Series Vacuum reflow oven unparalleled heating performance and temperature control system meets the requirements of various soldering processes, LV Series Vacuum Reflow Oven is high-end reflow products committed to keeping up with market demand to enhance customers competitiveness.Its new design concept fully meets the needs of increasingly diverse processes, And considering the future direction of the industry, entirely suitable for communications, automotive electronics, home appliances, computers and other consumer electronic products.
Features:
1.Control System: PC + Siemens PLC control system,accurate temperature control and more stable,ensures temperature stability rate to be more than 99.99%；
2.Vacuum system: PCB enters the vacuum unit directly from the welding area, starts the vacuum process, and the vacuum pressure is reduced to 100mbar-5mbar. The internal pores, voids and other gases overflow from the molten solder joints;
3.Hot air system: first-class heating module, the best temperature zone interval design makes optimum temperature uniformity and repeat. The effective utilization and thermal compensation efficiency,it needs less than 20 minutes from temperature control accuracy ± 1 ℃ ambient temperature to a temperature stabilization；
4.Monitoring Software:Windows interface, traditional and simplified Chinese and English online free switch, and operator password management, easy to operate.Operation records, temperature curve measurement and analysis functions, virtual simulation, fault self-diagnosis, process monitoring, automatic generate and save process control documents, substrate transport dynamic display;
5.Cooling System: new cooling zone, quick and easy adjustment, easily reach the cooling requirements of different slopes;
Product:
1. Optical fiber sensor senses PCB board to ensure accurate production rhythm;
2. Pneumatic structure design of vacuum chamber switch, good vacuum chamber sealing;
3. High-power independent vacuum pump, providing a minimum vacuum degree of 5mbar;
Vacuum pump
High-power vacuum pump, providing excellent vacuum efficiency, greatly reducing the void rate of solder pads and improving soldering
results;
Linear profile
With linear profile, components are not heated in a step-by-step manner during soldering, but along the same linear temperature gradient. Linear profile can shorten cycle time and help reduce soldering errors such as tombstone phenomenon.
.
Heating System
1. Insulation cotton between the preheating zone and the outer wall provides the best insulation effect;
2. Using precise temperature curves, we can generate accurate and repeatable temperature curves;
Specification:
| LV Series Vacuum Reflow Oven | I.C.T-LV623 | I.C.T-LV733 |
Dimensions | L6405*W1695*H1630 | L7164*W1695*H1630 |
Weight | 3000 kg | 3500 kg |
| Number of heating zone | Top 8 /Bottom 8 | Top 10 /Bottom 0 |
| Length of heating zone | 3110mm | 3892mm |
| Number of cooling zone | Top 3 /Bottom 3 | Top 3 /Bottom 3 |
| Exhaust volume requiement | 11m³/min*2 | 12m³/min*2 |
| Power | 3phase, N,PE;AC380V50/60HZ | |
| Normal power consumption | 10KW | 12KW |
| Temperature control Mode | PID close loop cont+SSR driving | |
| Conveyor system | ||
| Rails structure | Three-stage independent | |
| Max width of PCB | 150*150MM-400*400MM | |
| Range of rail width | 50mm-400mm | |
| Components height | Up 25mm/down 25mm | |
| Conveyor fixed type | Front end fixing | |
| PCB conveyor direction | Guide rail plus chain | |
| Conveyor height | 900±20mm | |
| Cooling system | ||
| Cooling method | Forced air cooling (vacuum reflow soldering) Chiller cooling (vacuum nitrogen reflow soldering) | |
| Nitrogen System | Nitrogen confined structures and pipelines, nitrogen flow meters, chillers | |
As the operating efficiency depends on the settings of the process parameters, the values reached actually can differ from the values indicated here. | ||
I.C.T keeps working on quality and performance, specifications and appearance may be updated without particular notice.
FAQ:
Q: What Is a Vacuum Reflow Oven Machine in SMT?
A: A Vacuum Reflow Oven Machine is a specialized equipment used in Surface Mount Technology (SMT) for soldering electronic components onto printed circuit boards (PCBs). It creates a controlled environment with reduced oxygen levels to prevent solder oxidation during the soldering process.
Q: How Does a Vacuum Reflow Oven Work?
A: A Vacuum Reflow Oven works by lowering the atmospheric pressure inside the chamber, reducing oxygen levels. This prevents solder oxidation and enhances the quality of solder joints during the reflow soldering process, especially for sensitive or critical components.
Q:: What Are the Advantages of Using a Vacuum Reflow Oven in SMT?
A: The advantages of using a Vacuum Reflow Oven in SMT include reduced solder defects, improved solder joint quality, enhanced reliability for critical components, and the ability to handle lead-free and sensitive materials effectively.
Q:: When Should You Consider Using a Vacuum Reflow Oven Machine?
A: Consider using a Vacuum Reflow Oven when soldering delicate or sensitive components, high-reliability applications, or assemblies that require precise control over solder joint quality. It's a valuable tool for achieving superior soldering results in demanding SMT manufacturing scenarios.
I.C.T - Our Company
About I.C.T:
I.C.T is a leading provider of factory planning solution. We have 3 wholly-owned factories, providing professional consultation and services for global customers. We have more than 22 years of eletronic overall solutions. We not only provide a complete set of equipment, but also provide full range of technical support and services, and give customers more reasonable professional advice. We help many customersv to set up factories in LED, TV, mobile phone, DVB, EMS and other indutries all over the world. We are to set up factories in LED, TV, mobile phone, DVB, EMS and other indutries all over the world. We are trustworthy.
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