~ 23,500CPH chip (Laser centering/Optimum)
~18,500CPH (Laser centering / IPC9850)
~9,000CPH IC(Vision centering/MNVC option)
~One multi-nozzle laser head (6 nozzles)
~From 0402(01005)to 33.5mm square components
~Supported PWB size: M/L size
Continued Evolution of the KE Series
| Chip | 23,500CPH chip (Laser centering / Optimum) 18,500CPH (Laser centering / IPC9850) |
|---|---|
| IC | 9,000CPH (Vision centering / MNVC option) |
From 0402(01005) to 33.5mm square components
One multi-nozzle laser head (6 nozzles)
The use of electronic double tape feeders enables mounting of a maximum of 160 component types.
High-speed, on-the-fly vision centering
(When using both high-resolution camera and MNVC. (option))
Longer sized PWB in X axis (option)
| Board size | M size (330×250mm) | Yes |
| L size (410×360mm) | Yes | |
| L-Wide size (510×360mm) *1 | Yes | |
| XL size (610×560mm) | Yes | |
| Applicability to long PWB (M size)*2 | 650×250mm | |
| Applicability to long PWB (L size)*2 | 800×360mm | |
| Applicability to long PWB (L-Wide size)*2 | 1,010×360mm | |
| Applicability to long PWB (XL size)*2 | 1,210×560mm | |
| Component height | 6mm | 12mm |
| 12mm | 12mm | |
| Component size | Laser recognition | 0402(01005) ~ 33.5mm |
| Vision recognition | 3mm*3 ~ 33.5mm | |
| 1.0×0.5mm*4 ~ □20mm | ||
| Placement speed | Optimum | 23,500CPH |
| IPC9850 | 18,500CPH | |
| IC *5 | 9,000CPH *6 | |
| Placement accuracy | Laser recognition | ±0.05 mm (±3σ) |
| Vision recognition | ±0.04mm | |
| Feeder inputs | Max.160 in case of 8mm tape (on a Electric double tape feeder)*7 | |
*1 L-Wide size is optional
*2 Applicability to long PWB is optional.
*3 When using MNVC. (option)
*4 KE-3010A ： When using both high-resolution camera and MNVC. (option)
*5 Effective tact : The IC placement speed indicates an estimated value obtained when the machine places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board. (CPH=number of components placed for one hour)
*6 Estimated value when using MNVC and picking up components simultaneous with all nozzles.
MNVC is option in the KE-3010A.
*7 When using Electric double tape feeder EF08HD.
* PWB size XL will be KE-3010
FAQ:
1. What is an SMT process?
The SMT (Surface Mount Technology) process is a method used in electronics manufacturing to assemble electronic circuits. In this process, electronic components with small, flat leads (surface mount devices or SMDs) are mounted directly onto the surface of a printed circuit board (PCB) using automated machines. SMT offers advantages such as smaller PCB size, higher component density, and automated assembly.
2. What is CPH in SMT?
CPH stands for "Components Per Hour" in the context of SMT (Surface Mount Technology). It is a measure of the production speed of a pick-and-place machine or assembly line. CPH indicates how many electronic components the machine can accurately place onto PCBs in one hour. Higher CPH values indicate faster and more efficient assembly processes.
3. How does an SMT pick and place machine work?
An SMT pick and place machine automates the process of accurately placing electronic components (such as resistors, capacitors, ICs, and more) onto printed circuit boards (PCBs). Here's how it works:
Vision Systems: The machine uses vision systems and cameras to identify fiducial marks and reference points on the PCB to ensure precise component placement.
Component Pickup: A robotic arm equipped with vacuum nozzles or grippers picks up components from reels, trays, or other feeders.
Placement: The machine places each component onto the PCB in its designated location based on the PCB design file.
Soldering: After placement, the PCB is typically passed through a reflow soldering oven or other soldering equipment to permanently attach the components to the board.
Inspection: Quality control systems may be used to inspect the solder joints and component placement accuracy.
Output: The completed PCBs are then ready for further assembly or testing.
This automated process ensures high-speed, high-precision, and consistent assembly of electronic circuits.
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