The NPM-TT2 (Next Production Modular-Twin Tray II) platform represents the next generation in twin tray modular production from Panasonic’s award-winning NPM platform—ideal for any mix.
Further bolstering the SMT process to accommodate more tray-supplied parts in full independently-run-lane mode, the NPM-TT2 processes boards up to 510 x 590mm and its dual lane functionality allows assembly of more of one product or two different products at the same time.
Featuring an advanced lightweight 3-nozzle head V2 (100N), pin-in-place lighting option and stackable stick feeders, the NPM-TT2 leads the way in terms of odd-placement capabilities.
Panasonic Pick and Place Machine
Compatible with lightweight 8-nozzle or 3-nozzle head V2
Part Range: (01005) 0402 chip to 1 20L x 90W x 28T to BGA up to 80 x 80 component range
Process up to 40 trays and 26 fixed tape and reel inputs per side for a total of 92 available inputs
Minimize downtime with pre-pickup smart tray component inspection and interchangeable feeder and tray locations
Compatible with CM and NPM-series intelligent feeders & nozzles
| Model ID | NPM-TT2 |
|---|---|
| Model No. | NM-EJM1E |
| PCB Dimensions (mm) | PC size Single-lane mode: L 50 x W 50 ~ L 510 x W 590 Dual-lane mode: L 50 x W 50 ~ L 510 x W 300 |
| PCB Dimensions (mm) | M size Single-lane mode: L 50 x W 50 ~ L 510 x W 510 Dual-lane mode: L 50 x W 50 ~ L 510 x W 260 |
| PCB Exchange Time | Single-lane mode: 4.0 s (With no component mounted on the reverse side of PCB) Dual-lane mode: 0 s* *No 0s when cycle time is 4.0 s or less |
| Electric Source | 3-phase AC 200, 220, 380, 400, 420, 480 V 2.5 kVA |
| Pneumatic Source | Min.0.5 MPa, 200 L /min (A.N.R.) |
| Dimensions (mm) * | W 1,300 [*2] x D 2,798 [*3] x H 1,444 [*4] [*1] |
| Mass | 2,690 kg (Only for main body : This differs depending on the option configuration) |
*Values such as maximum speed may vary depending on operating conditions.
*Please contact I.C.T for details.
FAQ:
Q: What is SMT for PCB?
SMT, which stands for Surface Mount Technology, is a method used in electronics manufacturing to mount or attach electronic components directly onto the surface of a printed circuit board (PCB). It involves placing surface mount devices (SMDs) onto the PCB's surface and soldering them in place, as opposed to through-hole technology, where components have leads inserted through holes in the PCB.
Q: What is the SMT mounter process?
The SMT mounter process is a key step in electronics manufacturing that involves using automated pick-and-place machines, also known as SMT mounters or chip mounters. These machines precisely pick up surface mount components (SMDs) from feeders and place them onto designated locations on the PCB. The process ensures accurate and efficient assembly of electronic circuits.
Q: What is PCB mounting?
PCB mounting refers to the process of physically attaching or securing a printed circuit board (PCB) to a specific location within an electronic device or assembly. It involves fixing the PCB securely, often using screws, standoffs, or mounting brackets, to ensure stability and proper alignment within the device's enclosure.
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