Publish Time: 2022-05-23 Origin: Site
SAMSUNG Pick & Place Machine has many requirements for the quality of the stencil during the placement process. Next, let's talk about the factors that determine the quality of the stencil during the placement of SAMSUNG Pick & Place Machine.
This is the content list:
l Craftsmanship
l Materials used
l Opening design
l Make information
l Instructions
l Cleaning
l store
Earlier we discussed the production process of SAMSUNG Pick & Place Machine stencil. It can be known that the best SAMSUNG Pick & Place Machine process should be electropolishing after laser stencil cutting, chemical etching and electroforming both exist as shou film and exposure. , Development and other processes that are prone to errors, and electroforming is also affected by the unevenness of the substrate.
Including PCB screen frame, wire mesh, steel sheet, adhesive glue, etc. The PCB screen frame must be able to withstand the relay of a certain procedure and have a good level; the screen is best to use a polyester mesh, which can maintain a stable tension for a long time ; The best steel sheet for SAMSUNG Pick & Place Machine is No. 304, and the matte type will be more conducive to the rolling of the solder paste than the mirror surface; the adhesive must be strong enough and able to withstand certain corrosion.
The quality of the opening design has the greatest impact on the quality of the SAMSUNG Pick & Place Machine steel mesh. As discussed earlier, the opening design should consider the production process, width to thickness ratio, area ratio, and experience values.
The completeness of the production data will also affect the quality of the SAMSUNG Pick & Place Machine steel mesh. The more complete the data, the better. At the same time, when data coexist, it should be clear which shall prevail. Also, generally speaking, making stencils with data files can reduce errors as much as possible.
The correct printing method of SAMSUNG Pick & Place Machine can maintain the quality of the stencil. On the contrary, the incorrect printing method such as excessive pressure, the SAMSUNG Pick & Place Machine stencil or PCB is not level during printing, etc., will cause the stencil to be affected. damage.
The solder paste is easier to solidify. If it is not cleaned in time, the opening of the stencil will be blocked, and the next printing will be difficult. Therefore, after the SAMSUNG Pick & Place Machine stencil is removed from the machine or the solder paste is not printed on the printing machine for 1 hour, it should be cleaned in time.
The steel mesh is used in a specific storage place and cannot be placed randomly, so as to avoid accidental damage to the steel mesh. At the same time, the steel mesh provided with SAMSUNG Pick & Place Machine should not be stacked together, so that it is not easy to handle and may bend the screen frame.