Successful Delivery of Semiconductor Production Line to Malaysian Partner

We recently delivered a state-of-the-art semiconductor production line to a key partner in Malaysia. The production line comprises a Advanced Loader, Automatic Laser Cutting Machine, and PCBA/IC Placement Machine, offering our partner an efficient and precise semiconductor manufacturing solution. In May, our engineer Tony goes to our partners' factories to install and commission production lines, providing comprehensive technical support and training. As per the partner's requirements, we conducted various tests on semiconductor product cutting and placement. The machine was successfully delivered in June and is now operating smoothly.

Background

Our partner is a Malaysian company specializing in the Semiconductor Manufacturing Industry. They faced challenges in the process of dicing and placing semiconductor products and sought a reliable partner to address this issue.

Needs and Challenges

The Malaysian partner required an efficient production line, including a Advanced Loader, Automatic Laser Cutting Machine, and PCBA/IC Placement Machine, to meet their growing production demands. Additionally, they needed a professional team to provide technical support and training, ensuring the proper operation of the equipment and effective resolution of any potential issues.

Semicon Solution

Prior to this case, we closely collaborated with the partner to understand their needs and challenges. Based on their requirements, we designed and built a customized semiconductor cutting and placing machine production line, incorporating the high-performance Advanced Loader, Automatic Laser Cutting Machine, and PCBA/IC Placement Machine.

Advanced Loader

The advanced Loader optimizes the production process by accurately and efficiently loading semiconductor products onto the production line. Its automation features significantly reduce manual labor, saving time and ensuring consistent production quality.

Automatic Laser Singulation System

The automated Laser Cutting Machine is a cutting-edge technology that enables precise and efficient separation of semiconductor wafers. With its high-speed laser and advanced control system, it achieves exceptional accuracy, minimizing material loss and maximizing yield. This state-of-the-art machine guarantees excellent results and supports the partner's commitment to delivering high-quality semiconductor products.

Pick and Place Offloading System

The I.C.T Automatic Tray Placement Machine is designed specifically for the automatic dicing machine. It is characterized by high efficiency, labor-saving, and high qualification rate. It is especially suitable for manufacturers with high requirements for electrostatic protection, such as automotive electronics and mobile phone motherboards.

Technical Support and Training

Understanding the importance of seamless integration and optimized utilization of the production line, our engineer, Tony, visited the partner's facility in May. Tony provided comprehensive technical support, overseeing equipment setup, calibration, and fine-tuning. Additionally, he conducted extensive training sessions for the partner's engineering team, equipping them with the knowledge and skills required for efficient operation and maintenance of the production line.

Testing and Customization

To meet the partner's specific requirements, we conducted extensive testing on the dicing and placement of various semiconductor products. Our team worked closely with the partner to ensure the production line was tailored to their specific needs. This customization ensures optimal performance and excellent results for the partner's specific semiconductor applications.

Conclusion

We are delighted to have successfully delivered an advanced semiconductor production line to our esteemed partner in Malaysia. Our integrated solution, empowers our partner to enhance their manufacturing capabilities and achieve their production goals efficiently.