English Views: 0 Author: Dongguan Intercontinental Technology Co.,Ltd. Publish Time: 2021-06-21 Origin: www.smtfactory.com
Full-auto SMT Stencil Printer is a device that prints solder paste onto PCB boards. There are mainly manual printers, semi-automatic printers and fully automatic printers. For different printing machines, the cleaning of the Full-auto SMT Stencil Printer stencil can be divided into online automatic cleaning and offline manual cleaning at the bottom of the screen. The online automatic cleaning of the bottom of the stencil is mainly the online cleaning of the bottom of the stencil supporting the Full-auto SMT Stencil Printer equipment.
This is the content list:
What are the tools and raw materials of a Full-auto SMT Stencil Printer?
What are the method steps of a Full-auto SMT Stencil Printer?
What are the precautions for cleaning up Full-auto SMT Stencil Printer?
In order to ensure the printing quality of the Full-auto SMT Stencil Printer and avoid the residual tin paste on the mesh and the residual tin powder on the stencil from contaminating the PCB surface, it is necessary to wipe and clean the bottom of the printed stencil regularly and fixedly to prevent the solder paste from contaminating the board surface. After soldering, tin bead appears on the board surface, and the full-auto SMT Stencil Printer is guaranteed to print the solder paste form, shape, and solder paste quantity and other technical indicators. The structure system of Full-auto SMT Stencil Printer is equipped with a special cleaning wiping system. The wiping system includes the following parts: wet wiping, vacuum wiping and dry wiping.
During the cleaning process (wet wiping), the air cylinder lifts the wiping rod when wiping, so that the wiping paper contacts the steel plate.
Pour the cleaning agent into the cleaning agent pump. The cleaning agent pump has a spraying process of 3 to 4 seconds. The cleaning agent wets the wipe paper through the cleaning agent stick.
When wet wiping Full-auto SMT Stencil Printer, the amount of cleaning agent should be controlled after the wet wipe is completed, and the wet wipe paper is just used up.
The spray volume of the cleaning agent can be controlled by adjusting the frequency and stroke of the cleaning agent pump.
First of all, cleaning the bottom of the Full-auto SMT Stencil Printer stencil is also a factor to ensure the printing quality. Secondly, the cleaning mode and cleaning frequency should be determined according to the solder paste, stencil material, thickness, and opening size. Finally, the spraying distance, spraying speed, wiping speed, wiping distance and other parameter settings are generally set according to the type of Full-auto SMT Stencil Printer.
