English  |
I.C.T-S400
I.C.T
spi machine
| Quantity: | |
|---|---|
I.C.T 3D SPI can completely solve the problem of shadow and random reflection in the detection process, so that solder paste 3D detection accuracy is higher; equipped with a 5M pixel high-speed camera, detection speed is faster, the image is more delicate and rich; it is an ideal choice for high-speed and high-precision production lines.
Features of 3D SPI SMT Solder Paste Inspection Machine:
1. The lens of professional lens design makes the image more uniform and delicate, and greatly improves the stability of detection.
2. It can be imported into Gerber file programming, or can be used to edit and debug money from image editing mode.
3.The multi direction 3D projection method can effectively solve the detection error caused by the shadow effect in the solder paste
detection process.
4.The operation system improves the result recognition and processing function according to the user level interface structure.
5. High precision programmable black and white moire fringe, the highest measuring accuracy 0.67um.
6.Based on accurate 3 dimensional measurement data, operators can optimize the whole project in a short time.
3D Technology
High precision programmable black and white moire fringe. High precision light source control technology, multiple multiple exposures. The highest measuring accuracy 0.67um.
The fringe rays are projected and collected, and multiple images are taken at one time for comprehensive calculation.
Strobe, constant light, instant exposure,Multiple exposure, 10 channelsHigh precision light source control.
Compact structure, minimum footprint, monorail dual rail
PCB optional.
Integral casting structure, FPC compatible, PCB can be up to 1200 * 500mm.
Specification of 3D SPI SMT Solder Paste Inspection Machine:
| Model | I.C.T-S400 | I.C.T-S400D | I.C.T-S1200 |
| PCB Size | 55*55 ~460*460mm (470*500mm as option) (630*686mm as option) | 55*55 ~450*310mm Dual (470*310mm Dual as option) (630*310mm Dual as option) | 55*55 ~ 1200*650mm |
| PCB Tickness | 0.5 ~ 7.0mm | ||
| PCB Weight | ≤5.0kg | ||
| Conveyor Adjustment | Automatic | ||
| Measure Type | Height,Area,Volume,Offset,Bridge,Shape(missing print,insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination) | ||
| Paste Height | 0 ~ 550um | ||
| Min Pad Pitch | ≥100um | ||
| Measure Principle | 3D white light PSLM PMP(Programmable Spatial Light Modulation, Phase Measurement Profilometry) | ||
| Inspection Head Quantity | 1 | ||
| Camera Pixel | 5M, (10M/12M as option) | ||
| Detection Speed | 0.35 ~ 0.5s/FOV | ||
| Program Time | 5 ~ 10min | ||
| Data Type | Gerber Data 274D/274X, Scan PCB | ||
| Power | AC220,50/60Hz,1KVA | ||
| Machine Dimension | 1000*1150*1530mm | 1000*1350*1530mm | 1730*1420*1530mm |
| Weight | 965kg | 1200kg | 1600kg |
* I.C.T keeps working on quality and performance,specifications and appearance may be updated without particular notice.
I.C.T 3D SPI can completely solve the problem of shadow and random reflection in the detection process, so that solder paste 3D detection accuracy is higher; equipped with a 5M pixel high-speed camera, detection speed is faster, the image is more delicate and rich; it is an ideal choice for high-speed and high-precision production lines.
Features of 3D SPI SMT Solder Paste Inspection Machine:
1. The lens of professional lens design makes the image more uniform and delicate, and greatly improves the stability of detection.
2. It can be imported into Gerber file programming, or can be used to edit and debug money from image editing mode.
3.The multi direction 3D projection method can effectively solve the detection error caused by the shadow effect in the solder paste
detection process.
4.The operation system improves the result recognition and processing function according to the user level interface structure.
5. High precision programmable black and white moire fringe, the highest measuring accuracy 0.67um.
6.Based on accurate 3 dimensional measurement data, operators can optimize the whole project in a short time.
3D Technology
High precision programmable black and white moire fringe. High precision light source control technology, multiple multiple exposures. The highest measuring accuracy 0.67um.
The fringe rays are projected and collected, and multiple images are taken at one time for comprehensive calculation.
Strobe, constant light, instant exposure,Multiple exposure, 10 channelsHigh precision light source control.
Compact structure, minimum footprint, monorail dual rail
PCB optional.
Integral casting structure, FPC compatible, PCB can be up to 1200 * 500mm.
Specification of 3D SPI SMT Solder Paste Inspection Machine:
| Model | I.C.T-S400 | I.C.T-S400D | I.C.T-S1200 |
| PCB Size | 55*55 ~460*460mm (470*500mm as option) (630*686mm as option) | 55*55 ~450*310mm Dual (470*310mm Dual as option) (630*310mm Dual as option) | 55*55 ~ 1200*650mm |
| PCB Tickness | 0.5 ~ 7.0mm | ||
| PCB Weight | ≤5.0kg | ||
| Conveyor Adjustment | Automatic | ||
| Measure Type | Height,Area,Volume,Offset,Bridge,Shape(missing print,insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination) | ||
| Paste Height | 0 ~ 550um | ||
| Min Pad Pitch | ≥100um | ||
| Measure Principle | 3D white light PSLM PMP(Programmable Spatial Light Modulation, Phase Measurement Profilometry) | ||
| Inspection Head Quantity | 1 | ||
| Camera Pixel | 5M, (10M/12M as option) | ||
| Detection Speed | 0.35 ~ 0.5s/FOV | ||
| Program Time | 5 ~ 10min | ||
| Data Type | Gerber Data 274D/274X, Scan PCB | ||
| Power | AC220,50/60Hz,1KVA | ||
| Machine Dimension | 1000*1150*1530mm | 1000*1350*1530mm | 1730*1420*1530mm |
| Weight | 965kg | 1200kg | 1600kg |
* I.C.T keeps working on quality and performance,specifications and appearance may be updated without particular notice.
