Introduction:
The industry's leading automatic stencil inspection machine I.C.T-S780, can quickly solve the problem of stencil making and cleaning, improve the cleaning process; establish the stencil management standards, improve production management system; replace manual inspeciton, reduce labor costs, improve product quality; and from the source to solve printing problem.
Full function:
Minimum inspection size: 30x30 μ m. Applicable to: quality inspection of semiconductor and SMT stencil.
Programming through Gerber file can be completed in 3 ~ 5 minutes.
Stencil hole inspection requires full coverage.
Microscopic observation of stencil wall.
Visual measurement of stepped stencil thickness.
High precision tension measurement scheme.
Inspection for poor hole of the whole plate.
Grouping and grading method:
For different sizes, different component types and different levels of holes, Use different levels of detection parameters to better ensure the accuracy of high-precision components.
Exclusive 3D stencil thickness measurement technology:
Based on the principle of triangulation, the thickness of stencil and the smoothness of hole wall are measured with a special 3D thickness measurement camera corresponding to the 45 degree angle of hole wall. t=h*sina; Through the 3D angle camera, the thickness of the hole is observed and calculated in real time. Measurement resolution: 0.12um, measurement accuracy: 1.2um.
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