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I.C.T | Reflow Oven 5 Zone

Name: I.C.T | Reflow Oven 5 Zone
Brand: I.C.T
Rating: 5.0 (36 reviews)

Reflow Oven 5 Zone
I.C.T Lyra Series Reflow Oven is made with Nitrogen Standard. Customer can add nitrogen at any time in future
I.C.T brings 26 years of experience in the SMT industry.
On-site installation and training Available. 24/7 Customer Service.
Highly Trained Experts. Accurate and economical. Vision guided DIY kit. Easy To Assemble. Open Source Software

Model:
I.C.T-Lyra622/622N
Brand:
I.C.T
Code:
Reflow Oven 5 Zone

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I.C.T | Reflow Oven 5 Zone

Introduction

I.C.T Lyra series lead-free reflow oven I.C.T’s mature product after years of market testing. Lyra Series Reflow oven has maintained a larger share of the market for many years. Its unparalleled heating performance and temperature control system meets the requirements of various soldering processes, It is I.C.T’s crystallization of years technical research and development.

Lyra Series Lead-free reflow is high-end reflow products committed to keeping up with market demand to enhance customers competitiveness.Its new design concept fully meets the needs of increasingly diverse processes, And considering the future direction of the industry, entirely suitable for communications, automotive electronics, home appliances, computers and other consumer electronic products.

Reflow Oven 5 Zone

Reflow Soldering Oven

SMT Reflow Soldering Oven

Reflow Oven Introduce

SMT Reflow Oven Introduce

Lyra Series Reflow Oven 5 Zone

High effective flux management system
High stability nitrogen protection system
High performance cooling system
Support the CBS, Split Unit

Model	Lyra 622/622N	Lyra 733/733N	Lyra 933/ 933N
Quantity of preheating zones	6	7	9
Quantity of peak zones	2	3	3
Max. soldering temperature	pre-heating zones 300 °C and peak zones350 °C
Quantity of cooling zones	2	2	3
Mesh Width	Standard 440mm( Option 560 & 680mm )
Rail Width	Single Rail: 50 - 460mm, Option: 50 - 686mm other Width on request. Dual Rail Standard: 50 - 290mm*2
Dimensions	515014001500mm	625014001500mm	695014001500mm
Weight	2400 / 2600 kg	2800 / 3000 kg	3200 /3400 kg

* I.C.T keeps working on quality and performance, specifications and appearance may be updated without particular notice.

FAQ 1: What is a 5-Zone Reflow Oven?

Question: What is a 5-zone reflow oven?

Answer: A 5-zone reflow oven is a specialized type of reflow oven used in Surface Mount Technology (SMT) manufacturing. It features five distinct temperature zones, each carefully controlled to optimize the soldering process. These zones typically include preheat, soak, reflow, and cooling stages, allowing for precise temperature management. This ensures that the solder paste melts and solidifies correctly, forming reliable connections between electronic components and the printed circuit board (PCB).

FAQ 2: How Does a 5-Zone Reflow Oven Improve the Soldering Process?

Question: How does a 5-zone reflow oven improve the soldering process?

Answer: A 5-zone reflow oven improves the soldering process by providing precise control over the temperature profile across five distinct zones. Each zone can be set to specific temperatures to optimize the different stages of soldering:

Preheat Zone: Gradually heats the PCB and components to prevent thermal shock.
Soak Zone: Maintains a stable temperature to activate flux and ensure even heating.
Reflow Zone: Raises the temperature to melt the solder paste, forming strong solder joints.
Cooling Zone: Gradually cools down the assembly to solidify the solder and prevent thermal stress. This segmentation allows for a more controlled and efficient soldering process, reducing defects and improving the overall quality of electronic assemblies.

FAQ 3: What Are the Benefits of Using a 5-Zone Reflow Oven in SMT Manufacturing?

Question: What are the benefits of using a 5-zone reflow oven in SMT manufacturing?

Answer: Using a 5-zone reflow oven in SMT manufacturing offers several key benefits:

Enhanced Precision: Allows for fine-tuned temperature control, ensuring consistent and high-quality solder joints.
Improved Efficiency: Streamlines the soldering process, increasing production throughput and reducing cycle times.
Higher Reliability: Produces reliable and durable solder joints, minimizing the risk of defects and rework.
Flexibility: Suitable for a variety of PCB designs and component types, making it versatile for different manufacturing needs.
Energy Efficiency: Optimizes energy consumption by precisely controlling the heating process, leading to cost savings.