English Views: 0 Author: Dongguan Intercontinental Technology Co.,Ltd. Publish Time: 2021-10-18 Origin: www.smtfactory.com
Due to the continuous miniaturization of electronic products and the emergence of chip components, traditional welding methods can no longer meet the needs. The reflow soldering process was first used in the assembly of hybrid integrated circuits, and most of the components to be assembled and soldered were chip capacitors, chip inductors, mounted transistors and diodes. With the development of the entire SMT technology becoming more and more perfect, and the emergence of a variety of chip components (SMC) and mount devices (SMD), the reflow soldering process technology and equipment as part of the mounting technology has also been developed correspondingly, and its application is becoming more and more extensive. Almost all electronic product domains have been applied, and Lyra Reflow Oven technology, around the improvement of equipment, has also undergone the following development stages.
Process development of Lyra Reflow Oven for thermal plate and push plate thermal plate conduction
About the process development of infrared radiation Lyra Reflow Oven
About the technological development of the infrared heating wind Lyra Reflow Oven
This type of Lyra Reflow Oven relies on the heating of the heat source under the conveyor belt or push plate, and heats the components on the substrate through thermal conduction. It is used for single-sided assembly of thick film circuits with ceramic substrates. The Lyra Reflow Oven ceramic substrate can only be attached to the conveyor belt. In order to get enough heat, its structure is simple and the price is cheap.
This type of Lyra Reflow Oven is mostly conveyor belt, but the conveyor belt only supports and transfers the substrate. The heating method of Lyra Reflow Oven is mainly based on the infrared heat source to heat by radiation. The temperature in the furnace is more uniform than the previous method, and the mesh is more uniform. Large, suitable for reflow soldering and heating of double-sided assembled substrates. This type of Lyra Reflow Oven can be said to be the basic type of reflow oven.
This type of Lyra Reflow Oven is based on the IR furnace with hot air to make the temperature in the furnace more uniform. When using infrared radiation heating alone, people find that in the same heating environment, different materials and colors absorb heat differently, which causes The temperature rise ΔT is also different. For example, the package of SMD such as IC is black phenolic or epoxy, while the lead is white metal. When Lyra Reflow Oven is heated only, the temperature of the lead is lower than its black SMD body.
