English Views: 0 Author: Site Editor Publish Time: 2023-10-20 Origin: Site
Selective Soldering is an efficient electronic component assembly process that can accurately solder specific components on a PCB board, thereby improving production efficiency and quality. The selective soldering process parameters are key factors that affect soldering quality and efficiency. The following are the detailed parameters.
Here is the content list:
Soldering temperature
Solder nozzle height
Solder flow
Coking time
Coking rate
Nitrogen protection
Solder temperature is one of the selective soldering process parameters. It directly affects the formation and quality of solder joints. If the temperature is too low, it can lead to incomplete or uneven melting of the solder joint, which affects the reliability of the connection. If the temperature is too high, it can cause problems such as component damage or PCB deformation. Therefore, in the selective soldering process, it is necessary to adjust the soldering temperature according to the requirements of different components and PCB boards.
The nozzle on the selective soldering machine needs to be adjusted according to the height of the components and PCB board. If the nozzle is too far away from the PCB board, it may lead to unstable or unable to form solder joints; If the nozzle is too close to the PCB board, it can cause problems such as component damage or PCB board deformation. Therefore, in the selective soldering process, it is necessary to adjust the nozzle height according to the actual situation.
The nozzle used in the selective soldering process needs to control the flow rate by controlling the air pressure. If the flow rate is too high, it will cause too much solder liquid to accumulate on the PCB board, thereby affecting the connection quality; If the flow rate is too small, it can lead to incomplete solder joints. Therefore, in the selective soldering process, it is necessary to adjust the flow rate according to the actual situation.
In the selective soldering process, due to the use of a higher temperature heat source for heating, oxidation, evaporation, and other phenomena are prone to occur, resulting in defects such as bubbles and cracks. To avoid these problems, it is necessary to control the heating time and rate during heating, and timely cool down after heating to avoid staying in a high-temperature environment for too long.
Similar to coking time, controlling the heating rate is also a very important parameter. Rapid temperature rise may cause problems such as increased internal stress of materials and volatile matter spillage; Slow heating may cause problems such as oxidation and evaporation of the material surface. Therefore, in the selective soldering process, it is necessary to adjust the heating rate according to the actual situation.
Due to the sensitivity of electronic components to oxygen, nitrogen protection technology is commonly used in the selective soldering process to reduce the damage caused by oxygen to components. Injecting pure and dry nitrogen into the heating area can effectively reduce the damage caused by air to electronic components, and can improve connection quality and reliability.
In summary, when performing selective soldering, it is necessary to pay attention to the above parameters and adjust them strictly to the actual situation to ensure connection quality and efficiency. As a professional manufacturer, I.C.T. has many years of experience in selective soldering technology, as well as in research and development, and innovation.
If you are interested in the selective soldering process, you can contact us by browsing our website at https://www.smtfactory.com.
