Name: KE-3010A | JUKI High-Speed SMT Chip Shooter
Brand: JUKI
Rating: 5.0 (92 reviews)

KE-3010A | JUKI High-Speed SMT Chip Shooter

Introduction

JUKI KE-3010

KE-3010A High Speed SMT Chip Shooter

~ 23,500CPH chip (Laser centering/Optimum)

~18,500CPH (Laser centering / IPC9850)

~9,000CPH IC(Vision centering/MNVC option)

~One multi-nozzle laser head (6 nozzles)

~From 0402(01005)to 33.5mm square components

~Supported PWB size: M/L size

Feature

JUKI SMT Chip Shooter

Continued Evolution of the KE Series

Chip	23,500CPH chip (Laser centering / Optimum) 18,500CPH (Laser centering / IPC9850)
IC	9,000CPH (Vision centering / MNVC option)

From 0402(01005) to 33.5mm square components
One multi-nozzle laser head (6 nozzles)
The use of electronic double tape feeders enables mounting of a maximum of 160 component types.
High-speed, on-the-fly vision centering
(When using both high-resolution camera and MNVC. (option))
Longer sized PWB in X axis (option)

Specification

Board size	M size (330×250mm)	Yes
	L size (410×360mm)	Yes
	L-Wide size (510×360mm) *1	Yes
	XL size (610×560mm)	Yes
	Applicability to long PWB (M size)*2	650×250mm
	Applicability to long PWB (L size)*2	800×360mm
	Applicability to long PWB (L-Wide size)*2	1,010×360mm
	Applicability to long PWB (XL size)*2	1,210×560mm
Component height	6mm	12mm
Component height	12mm	12mm
Component size	Laser recognition	0402(01005) ~ 33.5mm
	Vision recognition	3mm*3 ~ 33.5mm
	Vision recognition	1.0×0.5mm*4 ~ □20mm
Placement speed	Optimum	23,500CPH
	IPC9850	18,500CPH
	IC *5	9,000CPH *6
Placement accuracy	Laser recognition	±0.05 mm (±3σ)
Placement accuracy	Vision recognition	±0.04mm
Feeder inputs		Max.160 in case of 8mm tape (on a Electric double tape feeder)*7

*1 L-Wide size is optional
*2 Applicability to long PWB is optional.
*3 When using MNVC. (option)
*4 KE-3010A ： When using both high-resolution camera and MNVC. (option)
*5 Effective tact : The IC placement speed indicates an estimated value obtained when the machine places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board. (CPH=number of components placed for one hour)
*6 Estimated value when using MNVC and picking up components simultaneous with all nozzles.
MNVC is option in the KE-3010A.
*7 When using Electric double tape feeder EF08HD.
* PWB size XL will be KE-3010

FAQ:

1. What is an SMT process?

The SMT (Surface Mount Technology) process is a method used in electronics manufacturing to assemble electronic circuits. In this process, electronic components with small, flat leads (surface mount devices or SMDs) are mounted directly onto the surface of a printed circuit board (PCB) using automated machines. SMT offers advantages such as smaller PCB size, higher component density, and automated assembly.

2. What is CPH in SMT?

CPH stands for "Components Per Hour" in the context of SMT (Surface Mount Technology). It is a measure of the production speed of a pick-and-place machine or assembly line. CPH indicates how many electronic components the machine can accurately place onto PCBs in one hour. Higher CPH values indicate faster and more efficient assembly processes.

3. How does an SMT pick and place machine work?

An SMT pick and place machine automates the process of accurately placing electronic components (such as resistors, capacitors, ICs, and more) onto printed circuit boards (PCBs). Here's how it works:

Vision Systems: The machine uses vision systems and cameras to identify fiducial marks and reference points on the PCB to ensure precise component placement.

Component Pickup: A robotic arm equipped with vacuum nozzles or grippers picks up components from reels, trays, or other feeders.

Placement: The machine places each component onto the PCB in its designated location based on the PCB design file.
Soldering: After placement, the PCB is typically passed through a reflow soldering oven or other soldering equipment to permanently attach the components to the board.

Inspection: Quality control systems may be used to inspect the solder joints and component placement accuracy.

Output: The completed PCBs are then ready for further assembly or testing.

This automated process ensures high-speed, high-precision, and consistent assembly of electronic circuits.

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