English Views: 0 Author: Site Editor Publish Time: 2022-05-31 Origin: Site
The wide application of Semi-auto SMT Production Line promotes the miniaturization and multi-function of electronic products, and provides conditions for mass production and low defect rate production. Semi-auto SMT Production Line is surface assembly technology, a new generation of electronic assembly technology developed from hybrid integrated circuit technology.
This is the content list:
l What are the adjustment methods for Semi-auto SMT Production Line?
l What are the development advantages of the Semi-auto SMT Production Line?
l What is the development trend of the Semi-auto SMT Production Line?
① Move the cursor to the asterisk corresponding to the identification point, and press the "Camera" button on HOD (Handheld Operating Device).
② First adjust the shape of the recognition point, adjust the recognition frame to be tangent to the periphery of the recognition point, press "Enter" to confirm and use the arrow keys to select the shape of the recognition point, select the corresponding shape, and then press "Enter" to confirm.
③ Use the arrow keys to adjust the sensitivity of recognition. After adjustment, press "Enter" to confirm.
④ Use the arrow keys to adjust the range of recognition, first adjust the upper left, then adjust the lower right, press "Enter" to confirm after adjustment.
⑤ After compiling the above Semi-auto SMT Production Line data, you can start compiling theSemi-auto SMT Production Line printing condition data, you can use the ALT key to activate the menu selection
The electronic products of the Semi-auto SMT Production Line show a trend of miniaturization and multi-function, especially the explosive growth of the consumer electronics market represented by mobile phones, which further drives the Semi-auto SMT Production Line surface mount The miniaturization of components and the high-density of product assembly, 0201 components, CSP, flipchip and other small and fine-pitch devices have also entered the practical application of Semi-auto SMT Production Line, which greatly improves the application level of technology and also increases the difficulty of the process.
With the development of IC packaging in the direction of high integration, high performance, multi-lead and narrow pitch, it promotes the wide application of Semi-auto SMT Production Line technology in high-end electronic products, but due to the limitation of process capability, it faces many technical difficulties. After 1998, BGA devices began to be widely used, especially in the communications manufacturing industry. The application proportion of BGA devices showed a rapid growth. At the same time, Semi-auto SMT Production Linetechnology, driven by high-end products such as communications, entered a period of rapid and good development.
