S20
I.C.T
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Quantity: | |
Ultimate Flexibility to realize 3D MID* Placement
Enhancement to 3D MID
Large board handling capability
Wide ranging component handling capability and high feeder capacity
Ultimate flexibility and fast & easy setup
*3D MID: Molded Interconnect Device
Yamaha Pick and Place Machine
Advance chip mounter
Fast & flexible pick and place machine
Multi-functional SMT placement
Fast flexible pick & place machine
1. Enhancement to 3D MID
2. Large board handling capability
3. Wide ranging component handling capability and high feeder capacity
4. Ultimate flexibility and fast & easy setup
S10 | S20 | |
---|---|---|
Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) | Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455) |
Board size(with input or output buffer used) | Min. L50 x W30mm to Max. L420 x W510mm | - |
Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L330 x W510mm | Min. L50 x W30mm to Max. L540 x W510mm |
Board thickness | 0.4 - 4.8mm | 0.4 - 4.8mm |
Board flow direction | Left to right (Std) | Left to right (Std) |
Board transfer speed | Max 900mm/sec | Max 900mm/sec |
Placement speed (12 heads + 2 theta) Opt. Cond. | 0.08sec/CHIP (45,000CPH) | 0.08sec/CHIP (45,000CPH) |
Placement accuracy A (μ+3σ) | CHIP +/-0.040mm | CHIP +/-0.040mm |
Placement accuracy B (μ+3σ) | IC +/-0.025mm | IC +/-0.025mm |
Placement angle | +/-180 degrees | +/-180 degrees |
Z axis control / Theta axis control | AC servo motor | AC servo motor |
Component height | Max 30mm*1 (Pre-placed components: max 25mm) | Max 30mm*1 (Pre-placed components: max 25mm) |
Applicable components | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) |
Component package | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray |
Drawback check | Vacuum check and vision check | Vacuum check and vision check |
Screen language | English, Chinese, Korean, Japanese | English, Chinese, Korean, Japanese |
Board positioning | Board grip unit, front reference, auto conveyor width adjustment | Board grip unit, front reference, auto conveyor width adjustment |
Component types | Max 90 types (8mm tape), 45 lanes x 2 | Max 180 types (8mm tape), 45 lanes x 4 |
Transfer height | 900 +/- 20mm | 900 +/- 20mm |
Machine dimensions, weight | L1250xD1750xH1420mm, Approx. 1,200kg | L1750xD1750xH1420mm, Approx. 1,500kg |
FAQ
Ultimate Flexibility to realize 3D MID* Placement
Enhancement to 3D MID
Large board handling capability
Wide ranging component handling capability and high feeder capacity
Ultimate flexibility and fast & easy setup
*3D MID: Molded Interconnect Device
Yamaha Pick and Place Machine
Advance chip mounter
Fast & flexible pick and place machine
Multi-functional SMT placement
Fast flexible pick & place machine
1. Enhancement to 3D MID
2. Large board handling capability
3. Wide ranging component handling capability and high feeder capacity
4. Ultimate flexibility and fast & easy setup
S10 | S20 | |
---|---|---|
Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) | Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455) |
Board size(with input or output buffer used) | Min. L50 x W30mm to Max. L420 x W510mm | - |
Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L330 x W510mm | Min. L50 x W30mm to Max. L540 x W510mm |
Board thickness | 0.4 - 4.8mm | 0.4 - 4.8mm |
Board flow direction | Left to right (Std) | Left to right (Std) |
Board transfer speed | Max 900mm/sec | Max 900mm/sec |
Placement speed (12 heads + 2 theta) Opt. Cond. | 0.08sec/CHIP (45,000CPH) | 0.08sec/CHIP (45,000CPH) |
Placement accuracy A (μ+3σ) | CHIP +/-0.040mm | CHIP +/-0.040mm |
Placement accuracy B (μ+3σ) | IC +/-0.025mm | IC +/-0.025mm |
Placement angle | +/-180 degrees | +/-180 degrees |
Z axis control / Theta axis control | AC servo motor | AC servo motor |
Component height | Max 30mm*1 (Pre-placed components: max 25mm) | Max 30mm*1 (Pre-placed components: max 25mm) |
Applicable components | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) |
Component package | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray |
Drawback check | Vacuum check and vision check | Vacuum check and vision check |
Screen language | English, Chinese, Korean, Japanese | English, Chinese, Korean, Japanese |
Board positioning | Board grip unit, front reference, auto conveyor width adjustment | Board grip unit, front reference, auto conveyor width adjustment |
Component types | Max 90 types (8mm tape), 45 lanes x 2 | Max 180 types (8mm tape), 45 lanes x 4 |
Transfer height | 900 +/- 20mm | 900 +/- 20mm |
Machine dimensions, weight | L1250xD1750xH1420mm, Approx. 1,200kg | L1750xD1750xH1420mm, Approx. 1,500kg |
FAQ
FAQ:
Q: What are the advantages of using SMT pick-and-place machines over manual assembly?
A: Advantages include higher speed, accuracy, consistency, and the ability to handle smaller components and complex designs.
Q: Can pick-and-place machines be integrated into automated assembly lines?
A: Yes, they can be seamlessly integrated into automated production lines for continuous manufacturing.
Q: What is the role of solder paste in SMT assembly?
A: Solder paste is applied to PCB pads before component placement. It melts during reflow soldering, creating electrical connections.
Q: How do you inspect the quality of solder joints made by pick-and-place machines?
A: Quality control methods, such as X-ray inspection and automated optical inspection (AOI), are used to examine solder joints for defects.
FAQ:
Q: What are the advantages of using SMT pick-and-place machines over manual assembly?
A: Advantages include higher speed, accuracy, consistency, and the ability to handle smaller components and complex designs.
Q: Can pick-and-place machines be integrated into automated assembly lines?
A: Yes, they can be seamlessly integrated into automated production lines for continuous manufacturing.
Q: What is the role of solder paste in SMT assembly?
A: Solder paste is applied to PCB pads before component placement. It melts during reflow soldering, creating electrical connections.
Q: How do you inspect the quality of solder joints made by pick-and-place machines?
A: Quality control methods, such as X-ray inspection and automated optical inspection (AOI), are used to examine solder joints for defects.
I.C.T - Our Company
About I.C.T:
I.C.T is a leading provider of factory planning solution. We have 3 wholly-owned factories, providing professional consultation and services for global customers. We have more than 22 years of eletronic overall solutions. We not only provide a complete set of equipment, but also provide full range of technical support and services, and give customers more reasonable professional advice. We help many customersv to set up factories in LED, TV, mobile phone, DVB, EMS and other indutries all over the world. We are to set up factories in LED, TV, mobile phone, DVB, EMS and other indutries all over the world. We are trustworthy.
Exhibition
I.C.T - Our Company
About I.C.T:
I.C.T is a leading provider of factory planning solution. We have 3 wholly-owned factories, providing professional consultation and services for global customers. We have more than 22 years of eletronic overall solutions. We not only provide a complete set of equipment, but also provide full range of technical support and services, and give customers more reasonable professional advice. We help many customersv to set up factories in LED, TV, mobile phone, DVB, EMS and other indutries all over the world. We are to set up factories in LED, TV, mobile phone, DVB, EMS and other indutries all over the world. We are trustworthy.
Exhibition
For SMT Factory Setup, We Can Do for You:
1. We Provide Full SMT Solution for You
2. We Provide Core Technology With Our Equipments
3. We Provide The Most Professional Tech Service
4. We Have Wealthy Experience on SMT Factory Setup
5. We Can Solve Any Question About SMT
For SMT Factory Setup, We Can Do for You:
1. We Provide Full SMT Solution for You
2. We Provide Core Technology With Our Equipments
3. We Provide The Most Professional Tech Service
4. We Have Wealthy Experience on SMT Factory Setup
5. We Can Solve Any Question About SMT