English Views: 0 Author: Dongguan Intercontinental Technology Co.,Ltd. Publish Time: 2021-08-12 Origin: www.smtfactory.com
70% of the quality problems in the SMT process quality are determined by the Full-auto SMT Stencil Printer process. Whether the Full-auto SMT Stencil Printer printing process parameter setting is reasonable is directly related to the quality of the printing, which requires a Full-auto SMT Stencil Printer. Full-auto SMT Stencil Printer operating technicians understand the parameters debugging skills of Full-auto SMT Stencil Printer, let’s share with you the parameters debugging skills of Full-auto SMT Stencil Printer.
Regarding the parameter debugging of the squeegee of the Full-auto SMT Stencil Printer.
Regarding the parameter debugging of the printing speed of Full-auto SMT Stencil Printer.
Regarding the parameter debugging of the stencil cleaning frequency of Full-auto SMT Stencil Printer.
Regarding the separate parameter debugging of Full-auto SMT Stencil Printer.
The maximum opening length of the stencil of Full-auto SMT Stencil Printer is 30~50mm on each side. In order to reduce the amount of solder paste added and the contact area between the solder paste and air, the length of the squeegee is smaller. At present, the maximum squeegee lengths available for the general Full-auto SMT Stencil Printer are 150mm/200mm/320mm. In order to increase the service life of the stencil and squeegee of the automatic solder paste printer, the squeegee pressure is lowered. Usually only need to scrape the solder paste on the stencil, leaving a single particle layer evacuated on the stencil is acceptable. The pressure of the front and back squeegee may vary depending on the condition of the squeegee.
The principle of setting the printing speed of Full-auto SMT Stencil Printer is to ensure that the solder paste has enough time to miss the printing. If the shape of the solder paste is not printed on the PCB pad, the printing speed can be appropriately reduced. The smaller the minimum component pin spacing on the printed circuit board, the greater the viscosity of the solder paste, and the printing speed needs to be reduced accordingly, and vice versa.
For the Full-auto SMT Stencil Printer, the frequency of wiping the screen is based on the tightness of the IC's feet. ICs with tight feet are likely to accumulate solder paste residues. If you need to clean the deposits in the mesh in time, you need to increase the cleaning frequency. The setting value of Full-auto SMT Stencil Printer should be a larger value under the premise of ensuring that the stencil is wiped clean.
The proper separation speed in the production process of Full-auto SMT Stencil Printer ensures that the missing solder paste maintains a good shape. When setting the separation speed, the minimum component spacing and solder paste viscosity on the printed board should be considered. The smaller the component spacing, the solder paste The higher the viscosity, the lower the relative separation speed. The separation distance of Full-auto SMT Stencil Printeris the thickness of the stencil plus a certain margin, the margin is about 1~1.5mm. The size of the release distance is related to the degree of deformation of the stencil and the tightness of the stencil. Its setting The criterion is to ensure that the thickest part of the solder paste on the pad can be separated normally.
