English Views: 0 Author: Site Editor Publish Time: 2022-04-20 Origin: Site
Semi-auto SMT Production Line, also called surface assembly technology, is a new generation of electronic assembly technology developed from hybrid integrated circuit technology. It is characterized by the use of component surface mount technology and reflow soldering technology. It has become a new generation in electronic product manufacturing.
This is the content list:
l What are the pre-production preparation conditions for Semi-auto SMT Production Line?
l What data is required for the production process of Semi-auto SMT Production Line?
l What are the data editing steps of Semi-auto SMT Production Line?
The main equipment of Semi-auto SMT Production Line includes: printing machine, placement machine (upper surface electronic components), reflow soldering, plug-in, wave furnace, test packaging. The wide application of SMT has promoted the miniaturization and multi-function of electronic products, and has provided conditions for mass production and low defect rate production.
The preparation of the Semi-auto SMT Production Line production program requires the preparation of the following types of data, and the preparation of the Semi-auto SMT Production Line needs to be carried out in the following order. PWB board/screen data input→printing condition data input→check data input→cleaning data input→supplemental data input The above data needs to be compiled mainly for the first item (PWB and screen data), the second item (printing condition data) And the fourth item (cleaning data).
l Data input: use the ALT key to activate the menu selection
l PWB/Stencil Data, a PWB board/screen data input screen will pop up at this time, the data that needs to be input in this screen are:
l PWB ID----The code name of the PWB currently produced.
l PWB size (X, Y), the length and width dimensions of the currently produced PWB.
l Layout offset (X, Y), the deviation of the current production PWB (generally refers to the lower right corner of the PWB).
l Thickness, the thickness of the currently produced PWB board.
l Stencil ID----The code name of the currently used stencil.
l Stencil size (X, Y), the length and width dimensions of the stencil currently using Semi-auto SMT Production Line.
l Printer layout standard, select the mode of deviation standard of the current Semi-auto SMT Production Line printing.
l Origin offset (X, Y), the deviation between the PWB reference point and the screen reference point.
l PWB type-----Select PWB type in the selection box.
l BOC mark1 (X, Y), the deviation of PWB and stencil corrects the coordinates of the first recognition point.
l BOC mark2 (X, Y), the deviation of PWB and stencil corrects the coordinates of the second recognition point.
l The asterisk after SOC mark1, SOC mark2, BOC mark1, BOC mark2 indicates the identification information of the identification point.
