How to Assemble the Processing Technology of SAMSUNG Pick & Place Machine?

On the traditional THT printed circuit board, the components and solder joints are located on both sides of the board, while on the SAMSUNG Pick & Place Machine printed circuit board, the solder joints and components are on the same side of the board. Therefore, on the SAMSUNG Pick & Place Machine printed circuit board, the through holes are only used to connect the wires on both sides of the circuit board. The number of holes is much smaller, and the diameter of the holes is also much smaller, which can increase the assembly density of the circuit board. Great improvement, the following summarizes the assembly method of SAMSUNG Pick & Place Machine processing technology.

This is the content list:

• What are the types of assembly methods for SAMSUNG Pick & Place Machine?

• What is the single-sided hybrid assembly method of SAMSUNG Pick & Place Machine?

• What is the double-sided hybrid assembly method of SAMSUNG Pick & Place Machine?

What are the types of assembly methods for SAMSUNG Pick & Place Machine?

First of all, selecting the appropriate assembly method according to the specific requirements of the SAMSUNG Pick & Place Machine assembly products and the conditions of the assembly equipment is the basis for efficient and low-cost assembly and production, and is also the main content of the processing design of the SAMSUNG Pick & Place Machine. The so-called surface assembly technology refers to the chip structure components or miniaturized components suitable for surface assembly, placed on the surface of the printed board according to the requirements of the circuit, and assembled by soldering processes such as reflow soldering or wave soldering , Constitute the assembly technology of electronic components with certain functions.

Therefore, in general, SAMSUNG Pick & Place Machine can be divided into three types of single-sided mixed assembly, double-sided mixed assembly and full-surface assembly, a total of 6 assembly methods. Different types of SAMSUNG Pick & Place Machine have different assembly methods, and the same type of SAMSUNG Pick & Place Machine can have different assembly methods. And the assembly method and process flow of SAMSUNG Pick & Place Machine mainly depend on the type of surface mount component (SMA), the types of components used and the conditions of assembly equipment.

What is the single-sided hybrid assembly method of SAMSUNG Pick & Place Machine?

The first type is the single-sided hybrid assembly of the SAMSUNG Pick & Place Machine, that is, the SMC/SMD and through-hole plug-in components (17HC) are mixed and assembled on different sides of the PCB, but the welding surface is only one side. This type of assembly method uses single-sided PCB and wave soldering processes, and there are two specific assembly methods. The first is the first post method. The first assembly method is called the first-attach method, that is, the SMC/SMD is attached to the B side (welding side) of the PCB first, and then the THC is inserted on the A side. Then there is the post-posting method. The second assembly method is called post-attachment method, which is to first insert THC on the A side of the PCB, and then mount the SMD on the B side.

What is the double-sided hybrid assembly method of SAMSUNG Pick & Place Machine?

The second type is the double-sided hybrid assembly of SAMSUNG Pick & Place Machine. SMC/SMD and T.HC can be mixed and distributed on the same side of the PCB. At the same time, SMC/SMD can also be distributed on both sides of the PCB. SAMSUNG Pick & Place Machine double-sided hybrid assembly adopts double-sided PCB, double wave soldering or reflow soldering.

In this type of assembly method, there is also a difference between SMC/SMD or SMC/SMD. Generally, it is reasonable to choose according to the type of SMC/SMD and the size of the PCB. Usually, the first-sticking method is more adopted. Two assembly methods are commonly used in this type of assembly. The assembly method of this type of SAMSUNG Pick & Place Machine mounts SMC/SMD on one or both sides of the PCB, and inserts leaded components that are difficult to surface assembly. Therefore, the assembly density of the SAMSUNG Pick & Place Machine is quite high.

• SMC/SMD and ‘FHC are on the same side, SMC/SMD and THC are on the same side of the PCB.

• SMC/SMD and iFHC have different side methods. The surface mount integrated chip (SMIC) and THC are placed on the A side of the PCB, while the SMC and small outline transistor (SOT) are placed on the B side.