English Views: 0 Author: Site Editor Publish Time: 2024-03-21 Origin: Site
In today's fast-paced technological era, the clamor for smaller electronic devices is reaching unprecedented heights. Manufacturers are increasingly turning to the Solder Paste Jet Dispensing Machine for its streamlined solutions. These cutting-edge devices epitomize precision, automation, and quality control, all indispensable facets of modern electronics production. With features like XY linear motor drive control, the I.C.T-HD330 High-Precision Solder Paste Jet Dispensing Machine from Japan is setting new benchmarks for efficiency and accuracy. Its versatility extends across various industries, underpinned by I.C.T's unwavering commitment to excellence and unparalleled service.
The Solder Paste Jet Dispensing Machine offers tailor-made precision to suit diverse manufacturing requirements. Rapid customization capabilities and automatic needle height compensation bolster productivity and uniformity. Features like non-contact laser detection and high-speed micro-spraying ensure meticulous attention to detail and adaptability. With its precision solder paste printing capabilities, this machine excels in applications ranging from semiconductor packages to LED back-end assemblies and beyond.
Minimum Dispensing Quantity:
The automatic Solder Paste Jet Dispensing Machine excels in dispensing even the smallest quantities of solder paste, guaranteeing meticulous application for consistent results.
Dispensing Accuracy :
With exceptional accuracy reaching ±1 micron, the Solder Paste Jet Dispensing Machine ensures precise and repeatable solder paste deposition, thereby enhancing product quality.
Dispensing Speed:
Operating at a speed of 1500mm/sec, the machine offers swift and efficient dispensing without compromising accuracy, thereby optimizing productivity.
Minimum Printable Dot Diameter:
Capable of printing dot diameters as small as 110 microns, the machine ensures intricate patterns and fine features with exceptional precision.
Image Processing Speed:
Its lightning-fast image processing speeds enable real-time detection and compensation for deviations, ensuring consistent dispensing accuracy.
Efficiency of the I.C.T-HD330:
The Solder Paste Jet Dispensing Machine achieves dynamic positional accuracy within ±3 microns, ensuring uniform coating application and minimal solder paste consumption.
Height Compensation Mechanism in the I.C.T-HD330:
Utilizing a laser height measurement system, the machine guarantees precise height compensation, enabling consistent solder paste deposition across diverse PCB surfaces.
Choosing Dispensing Volume:
The selection of dispensing volume takes into account factors such as component size, material, and dispensing requirements, ensuring optimal performance and avoiding over-dispensing.
Reducing Solder Paste Overlapping: Dual Compensation Mechanism:
By automatically compensating for deviations in chip position and height, the machine minimizes solder paste overlapping, optimizing quality and minimizing waste.
Dual Compensation for Path and Volume: How Does It Work?
The machine achieves dual compensation for path and volume through automatic detection and adjustment mechanisms, ensuring precise solder paste deposition.
Manufactured in Japan, the Solder Paste Jet Dispensing Machine comes with professional technical support and training, ensuring proficient operation and maintenance. With comprehensive services and a steady supply of spare parts, clients can place their trust in I.C.T beyond the initial purchase.
